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AMD Mobile Sempron 3700+ - SMS3700HAX4CM information

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Type:CPU Manufacturer:AMD
family:K8 microprocessors:AMD Mobile Sempron 3000+ - SMS3000BQX2LF
Type CPU / Microprocessor
Market segment Mobile
Family
AMD Mobile Sempron
Model number    3700+
CPU part number
  • SMS3700HAX4CM is an OEM/tray microprocessor
Stepping code AFBAF
Frequency    3700+ (rated)
2000 MHz (real)
Clock multiplier    10
Package 638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm)
AMD Package number 29249
Socket Socket S1 (S1g1)
Architecture / Microarchitecture
Microarchitecture K8
Processor core    Keene
Core stepping    DH-F2
CPUID 40FC2
Manufacturing process 0.09 micron
Data width 64 bit
The number of cores 1
The number of threads 1
Floating Point Unit Integrated
Level 1 cache size    64 KB 2-way set associative instruction cache
64 KB 2-way set associative data cache
Level 2 cache size    512 KB 16-way set associative cache
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • Extensions to MMX
  • 3DNow! technology
  • Extensions to 3DNow!
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • AMD64 / AMD 64-bit technology   
  • EVP / Enhanced Virus Protection   
Low power features PowerNow! technology
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR2
Other peripherals One 16-bit HyperTransport link with speeds up to 800 MHz
Electrical / Thermal parameters
Maximum operating temperature    95°C
Thermal Design Power    25 Watt


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